Effects of Bi and In on the Growth of Intermetallic Compounds

淡江大學機構典藏 > 工學院 > 化學工程與材料工程學系暨研究所 > 會議論文 > Item 987654321/126344

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题名:	Effects of Bi and In on the Growth of Intermetallic Compounds
作者:	Wang, Yi-Wun;Liang, Hua-Tui;Tseng, Tzu-Ting;Wu, Guo-Wei
关键词:	Melting point;Carbon Emission;Bi Segregation;Cu-In Compounds
日期:	2024-03-03
上传时间:	2024-10-02 12:07:10 (UTC+8)
摘要:	The properties of solder determine product applications. Aerospace, automotive and consumer electronics need different type of solder. Melting point is one of the important criterions. The aim of this study is to develop lead-free solder for consumer electronics. Low-temperature lead-free solder is indispensable to consumer electronics. The advantages of lowering process temperature include easing device damage and carbon emission. We regard Bi and In as low-temperature solder candidates. Microstructural observations between low-temperature solder and Cu during reflow and aging reactions were investigated in this study. The experimental results are as follows: (1) Reflow temperature and Bi diffusion are responsible for Bi segregation at the interface; (2) A mixed layer of Cu-In compounds formed at low temperature; (3) The storage time of In-based solder could not be ignored.
显示于类别:	[化學工程與材料工程學系暨研究所] 會議論文

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