Injectable ChitHCl-MgSO4-DDA hydrogel as a bone void filler to improve cell migration and osteogenesis for bone regeneration

doi:10.1016/j.ijbiomac.2024.132409

淡江大學機構典藏 > 工學院 > 機械與機電工程學系暨研究所 > 期刊論文 > Item 987654321/125877

Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/125877

Title:	Injectable ChitHCl-MgSO4-DDA hydrogel as a bone void filler to improve cell migration and osteogenesis for bone regeneration
Authors:	Wang, Yu-tzu
Date:	2024-05-18
Issue Date:	2024-08-07 12:06:19 (UTC+8)
Abstract:	Suture pull-through is a clinical problem in meniscus repair surgery due to the sharp leading edge of sutures. Several tissue adhesives have been developed as an alternative to traditional suturing; however, there is still no suitable tissue adhesive specific for meniscus repair treatment due to unsatisfactory biosafety, biodegradable, sterilizable, and tissue-bonding characteristics. In this study, we used a tissue adhesive composed of chitosan hydrochloride reacted with oxidative periodate-oxidized dextran (ChitHCl-DDA) combined with a chitosan-based hydrogel and oxidative dextran to attach to the meniscus. We conducted viscoelastic tests, viscosity tests, lap shear stress tests, Fourier transform infrared (FTIR) spectroscopy, swelling ratio tests, and degradation behavior tests to characterize these materials. An MTT assay, alcian blue staining, migration assay, cell behavior observations, and protein expression tests were used to understand cell viability and responses. Moreover, ex vivo and in vivo tests were used to analyze tissue regeneration and biocompatibility of the ChitHCl-DDA tissue adhesive. Our results revealed that the ChitHCl-DDA tissue adhesive provided excellent tissue adhesive strength, cell viability, and cell responses. This tissue adhesive has great potential for torn meniscus tissue repair and regeneration.
Relation:	International Journal of Biological Macromolecules 270(2),　132409
DOI:	10.1016/j.ijbiomac.2024.132409
Appears in Collections:	[機械與機電工程學系暨研究所] 期刊論文

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