A New Silicon Mold Process for Polydimethylsiloxane Microchannels

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题名:	A New Silicon Mold Process for Polydimethylsiloxane Microchannels
作者:	Yang, Lung-jieh;Shaik, Sameer;Unnam, Neethish Kumar
关键词:	PDMS microchannel;laser cutting;anodic bonding
日期:	2024-06-29
上传时间:	2024-08-07 12:06:06 (UTC+8)
出版者:	MDPI
摘要:	As an alternative to SU-8 soft lithography, a new silicon mold process of fabricating PDMS microchannel chips was proposed. A picosecond laser is used to cut through a 550 μm thick silicon wafer and generate the original microchannel pattern with a 50 μm minimum feature size. This single-crystal silicon pattern, with the edge debris caused by laser cutting being trimmed off by a KOH solution and with the protection field oxide layer being removed by BOE afterwards, firmly resided on a glass substrate through the anodic bonding technique. Four-inch wafers with microchannel patterns as the PDMS mold cores were successfully bonded on Pyrex 7740 or Eagle XG glass substrates for the follow-up PDMS molding/demolding process. This new maskless process does not need a photolithography facility, but the laser cutting service must be provided by professional off-campus companies. One PDMS microchannel chip for particle separation was shown as an example of what can be achieved when using this new process.
關聯:	Micromachines 15(7),　848
DOI:	10.3390/mi15070848
显示于类别:	[機械與機電工程學系暨研究所] 期刊論文

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