A New Silicon Mold Process for Polydimethylsiloxane Microchannels

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Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/125874

Title:	A New Silicon Mold Process for Polydimethylsiloxane Microchannels
Authors:	Yang, Lung-jieh;Shaik, Sameer;Unnam, Neethish Kumar
Keywords:	PDMS microchannel;laser cutting;anodic bonding
Date:	2024-06-29
Issue Date:	2024-08-07 12:06:06 (UTC+8)
Publisher:	MDPI
Abstract:	As an alternative to SU-8 soft lithography, a new silicon mold process of fabricating PDMS microchannel chips was proposed. A picosecond laser is used to cut through a 550 μm thick silicon wafer and generate the original microchannel pattern with a 50 μm minimum feature size. This single-crystal silicon pattern, with the edge debris caused by laser cutting being trimmed off by a KOH solution and with the protection field oxide layer being removed by BOE afterwards, firmly resided on a glass substrate through the anodic bonding technique. Four-inch wafers with microchannel patterns as the PDMS mold cores were successfully bonded on Pyrex 7740 or Eagle XG glass substrates for the follow-up PDMS molding/demolding process. This new maskless process does not need a photolithography facility, but the laser cutting service must be provided by professional off-campus companies. One PDMS microchannel chip for particle separation was shown as an example of what can be achieved when using this new process.
Relation:	Micromachines 15(7),　848
DOI:	10.3390/mi15070848 全文
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Journal Article

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