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    題名: Microstructural characterization of Ti/Cu/Ti diffusion bonded system through a micromechanical data-driven neural network approach
    作者: Chen, Tzu-Chia
    關鍵詞: Diffusion bonding;Elastic modulus;Nanoindentation;Neural network
    日期: 2023-06
    上傳時間: 2024-03-07 12:06:27 (UTC+8)
    出版者: Elsevier Ltd
    摘要: In this work, a micromechanical data-driven neural network approach, named as adjacent gradient neural network (AGNN), was developed to characterize the microstructural features of Ti/Cu/Ti Diffusion Bonded joints with a wide range of interlayer thicknesses. The AGNN model facilitates the evaluation of microstructure on the basis of Young's modulus and hardness distributions in the joint zone. The results indicated that the AGNN model accurately classified the microstructural constituents including the stabilized eutectoid structure and the intermetallic compounds; however, there existed some deviations at high-hardness regions, which was originated from the low penetration depth in the indenting process. The predictive outcomes also quantitatively revealed that the increase in the interlayer thickness was accompanied with the generation of intermetallic compounds; however, the proportion of eutectoid structure decreased in the joint zone. In summary, the outcomes of this work indicate that it is feasible to predict the microstructural features of a Ti/Cu/Ti diffusion bonded joint with a preferred interlayer thickness and establish a meaningful correlation between the micromechanical properties and the morphological characteristics.
    關聯: Materials Today Communications 35, 105858
    DOI: 10.1016/j.mtcomm.2023.105858
    顯示於類別:[人工智慧學系] 期刊論文

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