Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects

doi:10.1016/j.jtice.2023.105099

淡江大學機構典藏 > 工學院 > 化學工程與材料工程學系暨研究所 > 期刊論文 > Item 987654321/124412

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題名:	Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects
作者:	Wang, Yi-wun
日期:	2023-08-24
上傳時間:	2023-08-28 12:05:16 (UTC+8)
出版者:	ELSEVIER
摘要:	Background Low-temperature solders are considered eco-friendly because of lowered wasted power, warpage, electromigration. In addition, chips are becoming increasingly integrated so as to achieve superior performance. Semiconductor packaging has moved from two-dimensional to three-dimensional integrated-circuits with vertical stacking for increased functionality. Thermal budget impacts electronic device manufacture, specifically in heterogeneous integration. Therefore, reduction of process temperatures is necessary. Methods Bi and In were selected in this study because they are commercial solders with low-melting points. Further, the microstructures and interfacial reactions of Bi–In solders have not been extensively studied. This study entailed a systematic examination of the interfacial reactions occurring between Bi67In and Cu metallization upon reflow and subsequent aging was performed. Findings It was observed that In segregates in the middle region of Cu11In9 after reflow. The phase transformations from Cu11In9 to CuIn2 start in the In segregation region. This remarkable phenomenon warrants in-depth research.
關聯:	Journal of the Taiwan Institute of Chemical Engineers 151,　105099
DOI:	10.1016/j.jtice.2023.105099
顯示於類別:	[化學工程與材料工程學系暨研究所] 期刊論文

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