淡江大學機構典藏:Item 987654321/121778
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 64178/96951 (66%)
造访人次 : 10079776      在线人数 : 19027
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧：
  • 您可在西文检索词汇前后加上"双引号"，以获取较精准的检索结果
  • 若欲以作者姓名搜寻，建议至进阶搜寻限定作者字段，可获得较完整数据
    •  进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/121778


    题名: Instrumentation of Twin-MCMs based Mutual-Test
    作者: Wang, S.S.P.;Wang, Y.T.;Chao, C.-L.;Yang, W.-B.
    关键词: Multi-chip module;Chiplet;Interposer;Substrate;Know-good-die;Flip-chip;Boundary scan;JTAG;Wafer scale integration
    日期: 2021-08
    上传时间: 2021-12-20 12:12:10 (UTC+8)
    出版者: Microelectronics Journal
    摘要: This paper presents advanced data collection methods using boundary scan based vector analysis, developed to debug manufacturing defects on cell based IC's such as JTAG compliant dice. Advantageously, they provide solutions to unknown dice by arranging identically designed Multi-chip Modules (MCM), to thereby diagnose possible flaws on dice due to thermal stresses on substrates as well as cold or hot soldering of the bumps, of which introducing fatigue and cracks, etc., defectives, and this system potentially to repair the problematic MCMs after trouble-shooting the twin-MCMs through self and mutual testing to validate the Known Good Dice (KGD).
    關聯: Microelectronics Journal 114, 105108
    DOI: 10.1016/j.mejo.2021.105108
    显示于类别:[人工智慧學系] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    index.html0KbHTML157检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈