English  |  正體中文  |  简体中文  |  Items with full text/Total items : 62805/95882 (66%)
Visitors : 3940723      Online Users : 1127
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/121111


    Title: INVESTIGATION ON THE DEGREE OF ASSEMBLY FOR COMPONENTS IN AN INJECTION FAMILY MOLD SYSTEM
    Authors: Lin, Tsai-Wen;Huang, Chao-Tsai;Jong, Wen-Ren;Chen, Shia-Chung
    Keywords: Family mold;degree of assembly;CAE simulation
    Date: 2021-05-11
    Issue Date: 2021-08-26 12:13:06 (UTC+8)
    Publisher: SPE
    Abstract: The main target for Design for Manufacturing and Assembly (DFMA) is to integrate multiple components with multiple functions to minimize cost and efforts. In addition, a family mold system has been utilized in industrial manufacturing to make a series integrated components for years. However, there is very few information to the degree of assembly for a single component or components. In this study, the degree of assembly using a family mold system with two different components has been investigated. The study methods include numerical simulation and experimental observation. Firstly, the packing pressure is adopted as the practical operation parameter to affect the variation of degree of assembly. Then the pre-defined characteristic lengths were utilized to catch the degree of assembly. Results showed that when a higher packing pressure applied in injection molding, it will results in more difficulty in the assembly for Part A and B by numerical prediction. Furthermore, the experimental validation on the degree of assembly based on the characteristic lengths has also performed. The tendency is quite consistent for both numerical simulation and experimental estimation. However, there is some gap between simulation prediction and experimental measurement for the same operation condition setting. To reduce that gap, future work is planned.
    Relation: SPE Technical Papers, ANTEC2021
    Appears in Collections:[化學工程與材料工程學系暨研究所] 期刊論文

    Files in This Item:

    File SizeFormat
    index.html0KbHTML39View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback