Method for forming structured film as molded by tape die

淡江大學機構典藏 > 工學院 > 機械與機電工程學系暨研究所 > 專利 > Item 987654321/119238

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题名:	Method for forming structured film as molded by tape die
作者:	Lin, Ching-Bin
日期:	2006-02-21
上传时间:	2020-09-24 12:12:14 (UTC+8)
摘要:	A method for forming structured or micro-structured film comprising the steps of: A. Coating a photocuring or heat-curing adhesive resin layer on a substrate layer; B. Molding or forming or imprinting a structured or micro-structured pattern including prismatic array on the adhesive resin layer by a tape die having the structured pattern preformed on the tape die; and C. Curing the photocuring or heat-curing adhesive resin layer on the substrate layer to obtain a layered film having a structured pattern surface. The structured pattern is formed on the tape, rather than on the rotary die or die roller, to prevent from sticking of the adhesive resin on the roller to prolong the service life of the production equipment and also to ensure a reliable film product quality.
显示于类别:	[機械與機電工程學系暨研究所] 專利

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