Method for forming structured film as molded by tape die

機構典藏 > College of Engineering > Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering > Patent > Item 987654321/119238

Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/119238

Title:	Method for forming structured film as molded by tape die
Authors:	Lin, Ching-Bin
Date:	2006-02-21
Issue Date:	2020-09-24 12:12:14 (UTC+8)
Abstract:	A method for forming structured or micro-structured film comprising the steps of: A. Coating a photocuring or heat-curing adhesive resin layer on a substrate layer; B. Molding or forming or imprinting a structured or micro-structured pattern including prismatic array on the adhesive resin layer by a tape die having the structured pattern preformed on the tape die; and C. Curing the photocuring or heat-curing adhesive resin layer on the substrate layer to obtain a layered film having a structured pattern surface. The structured pattern is formed on the tape, rather than on the rotary die or die roller, to prevent from sticking of the adhesive resin on the roller to prolong the service life of the production equipment and also to ensure a reliable film product quality.
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Patent

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