English  |  正體中文  |  简体中文  |  Items with full text/Total items : 60914/93528 (65%)
Visitors : 1558323      Online Users : 19
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/119238

    Title: Method for forming structured film as molded by tape die
    Authors: Lin, Ching-Bin
    Date: 2006/02/21
    Issue Date: 2020-09-24 12:12:14 (UTC+8)
    Abstract: A method for forming structured or micro-structured film comprising the steps of: A. Coating a photocuring or heat-curing adhesive resin layer on a substrate layer; B. Molding or forming or imprinting a structured or micro-structured pattern including prismatic array on the adhesive resin layer by a tape die having the structured pattern preformed on the tape die; and C. Curing the photocuring or heat-curing adhesive resin layer on the substrate layer to obtain a layered film having a structured pattern surface. The structured pattern is formed on the tape, rather than on the rotary die or die roller, to prevent from sticking of the adhesive resin on the roller to prolong the service life of the production equipment and also to ensure a reliable film product quality.
    Appears in Collections:[機械與機電工程學系暨研究所] 專利

    Files in This Item:

    There are no files associated with this item.

    All items in 機構典藏 are protected by copyright, with all rights reserved.

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback