Process and apparatus for plating copper on particulate graphite

淡江大學機構典藏 > 工學院 > 機械與機電工程學系暨研究所 > 專利 > Item 987654321/119222

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题名:	Process and apparatus for plating copper on particulate graphite
作者:	Lin, Ching-Bin;Lin, Jen-Fin
日期:	2000-06-05
上传时间:	2020-09-24 12:11:41 (UTC+8)
摘要:	A process for plating copper on particulate graphite comprises cleaning and drying the graphite particles; wetting the graphite particles with an aqueous solution of cupric sulfate and glacial acetic acid; dripping the graphite particles as wetted with a layer of the aqueous solution on a rotating metal (including zinc, aluminum and iron) disk to conduct a displacement reaction to plate copper, as displaced by the metal existing in situ on the metal disk, on each graphite particle; and washing the graphite particles as plated by copper with water and then drying the copper-plated graphite particles.
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