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    題名: Process and apparatus for plating copper on particulate graphite
    作者: Lin, Ching-Bin;Lin, Jen-Fin
    日期: 2000-06-05
    上傳時間: 2020-09-24 12:11:41 (UTC+8)
    摘要: A process for plating copper on particulate graphite comprises cleaning and drying the graphite particles; wetting the graphite particles with an aqueous solution of cupric sulfate and glacial acetic acid; dripping the graphite particles as wetted with a layer of the aqueous solution on a rotating metal (including zinc, aluminum and iron) disk to conduct a displacement reaction to plate copper, as displaced by the metal existing in situ on the metal disk, on each graphite particle; and washing the graphite particles as plated by copper with water and then drying the copper-plated graphite particles.
    顯示於類別:[機械與機電工程學系暨研究所] 專利

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