Guidably-recirculated heat dissipating means for cooling central processing unit

機構典藏 > College of Engineering > Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering > Patent > Item 987654321/119221

Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/119221

Title:	Guidably-recirculated heat dissipating means for cooling central processing unit
Authors:	Lin, Ching-Bin
Date:	2001-01-29
Issue Date:	2020-09-24 12:11:39 (UTC+8)
Abstract:	A heat dissipating device includes: a barrel having a plurality of fins formed on the barrel and having a buckle for fastening the barrel to a base board of a central processing unit (CPU) to conduct heat from CPU towards the barrel; a cooling fan contiguous to the fins and the barrel for cooling the fins and the barrel; a vaporizable coolant filled in the barrel; a guiding device provided in the barrel for guiding and ejecting the vapor as vaporized from a liquid coolant when absorbing the heat from CPU towards a cooled inside wall of the barrel to be condensed as a liquid coolant; and a capillary device formed on the inside wall for capillarily osmetically draining the liquid coolant towards a bottom of the barrel for enhancing a liquid-vapor two phase recirculation of the coolant for efficiently dissipating heat from the CPU.
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Patent

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