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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/114782


    Title: 應用於高功率筆記型電腦之散熱機制研究
    Other Titles: Research on the heat dissipation mechanism applied to high power notebook
    Authors: 許博皓;Hsu, Po-Hao
    Contributors: 淡江大學電機工程學系碩士在職專班
    周建興;Chou, Chien-Hsing
    Keywords: heat dissipation;High power;power bank;Thermal;行動電源;高功率;散熱
    Date: 2017
    Issue Date: 2018-08-03 15:03:54 (UTC+8)
    Abstract: 電源是現代人類不可或缺的重要能源之一,幾乎所有日常生活的電子產品都需要使用電源,因此不知不覺現在人對於電力的依賴也越來越中,行動電源就顯得相當重的,除了人人手上都有電子產品以外,行動電源也成為包包裡的必需品,而因為科技的日新月異,電子產品所使用的功率越來越大,電源容量的需求也慢慢地改變成大容量的趨勢,行動電源所需要的電力也越來越大,而越高的功率所產生出的熱能也是成正比的上升,會造成目前封閉式設計的行動電源極大的問題。
      本研究嘗試使用散熱片結合風扇的方法,在空間有限的情況下,利用溫度感測元件依照當下實際溫度並與MCU的PWM控制風扇轉速,設定調節點,同步控制溫度減少高功率元件在工作狀態時產生的發熱,避免導致系統切入降頻機制,使得效能分數變差,嚴重點使得系統突然斷電的風險,經過不斷實驗改良以及調整,已經有效的控制溫度的上升狀況,並穩定的維持高效能的輸出, 降低高溫度帶來的風險,改善了原先不穩定的因素,增長系統壽命,並減少高溫帶來的其他影響。
    Power supply is essential for the modern technology times. Since most of electrical products need power for working, the power bank becomes a necessary item in every day. In this study, a heat dissipation mechanism combined with the fan module was designed in limit space. The fan module is controlled by a microcontroller system with PWM function. It can control fan rotation rate and setting adjustment point to effectively control the raised of temperature. By applied the strategy, the proposed mechanism reduces the risk under high temperature and extent the stable-ability.
    Appears in Collections:[Graduate Institute & Department of Electrical Engineering] Thesis

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