English  |  正體中文  |  简体中文  |  Items with full text/Total items : 62830/95882 (66%)
Visitors : 4039141      Online Users : 697
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/113022


    Title: Enhanced reliability of LEDs encapsulated with surface-modified zirconia/silicone hybrids under thermal shock
    Authors: Yen-Ting Lin;Yen-Hsien Li;I-Ann Lei;Chih-Yu Kuo;Chia-Fen Lee;Wen-Yen Chiu;Trong-Ming Don
    Keywords: LED;Silicone;Zirconia;Encapsulation;Thermal shock
    Date: 2018-02-15
    Issue Date: 2018-03-29 12:11:06 (UTC+8)
    Publisher: Elsevier
    Abstract: This study focused on the importance of the interfacial adhesion in the zirconia (ZrO2)/silicone hybrids as the encapsulating material on the reliability of the LEDs. Surface-modified ZrO2 nanoparticles (m-ZrO2) with functional groups were prepared by a sol-gel reaction which could become reactive to the silicone resin. The produced m-ZrO2/silicone hybrid at 5 wt% had a refractive index of 1.569 at 633 nm and light transmittance of 98.9%. Moreover, the coefficient of thermal expansion was greatly reduced by the introduction of m-ZrO2 into the silicone resin. When using this m-ZrO2/silicone hybrid, the luminous flux of the LED was 10.1% higher than that using a neat silicone resin. Most importantly, the LEDs encapsulated with the m-ZrO2/silicone had the best performance under thermal shock among all the LEDs tested in this study, owing to its strong interfacial adhesion between the nanoparticles and matrix. Moreover, the thermal stresses developed in hybrids were calculated and found to agree with the performance evaluation of the encapsulated LEDs under thermal shock, in which the m-ZrO2/silicone hybrid had the lowest thermal stress. This study proposed that the m-ZrO2/silicone hybrid material with strong interfacial adhesion could be useful for the encapsulation of LEDs even under extreme thermal conditions.
    Relation: Materials Chemistry and Physics 206, p.136-143
    DOI: 10.1016/j.matchemphys.2017.12.011
    Appears in Collections:[Graduate Institute & Department of Chemical and Materials Engineering] Journal Article

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML233View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback