English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 62805/95882 (66%)
造訪人次 : 3946970      線上人數 : 562
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/112411


    題名: Optimizing the warpage of injection molding parts using 3D volume shrinkage compensation method
    作者: Chao-Tsai (CT) Huang;Cherng-Jyi Yeh;Gwo-Geng Lin;Wen-Ren Jong
    關鍵詞: 3D volume shrinkage compensation method (3DVSCM), injection molding, warpage optimization
    日期: 2017-05-09
    上傳時間: 2017-12-13 02:11:29 (UTC+8)
    摘要: Injection molding has been applied to manufacturing for various products for years. However, due to the requirement of high precision for modern products, the product development is still very challenge. Conventionally, people used to utilize the packing pressure technology (either enlarge packing pressure or extend the packing time) to enhance the dimension quality, but it is not always useful. In this study, first we have applied CAE technology to analyze why the conventional packing pressure is not always effectively. The reason is that the compiled injection system with different thickness along the product will cause non-uniform shrinkage all the time. It is not easy to compensate using packing pressure skill. Furthermore, we have applied 3D volume shrinkage compensation method (3DVSCM) to reduce the warpage defect based on a mobile phone benchmark. Results show that through various packing pressure operations the dimension deviations at different regions can be compensated simultaneously, no matter the region has higher or lower shrinkage. It is also tested under various operation conditions, such as different injection times, melting temperatures, mold temperatures, and so on. The modification is always so effectively. That means the high dimension quality demand is possible obtained utilizing 3D volume shrinkage compensation method under suitable process condition setting.
    關聯: SPE Technical Papers , Paper No. 78, pp.1-6 (2017).
    顯示於類別:[化學工程與材料工程學系暨研究所] 期刊論文

    文件中的檔案:

    沒有與此文件相關的檔案.

    在機構典藏中所有的資料項目都受到原著作權保護.

    TAIR相關文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回饋