淡江大學機構典藏:Item 987654321/111404
English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 62797/95867 (66%)
造訪人次 : 3748341      線上人數 : 458
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/111404


    題名: 磨料噴射技術應用於硬脆材料微孔陣列加工之研究
    其他題名: Abrasive jet machining of micro-hole array on brittle materials
    作者: 趙曾民;Chao, Tseng-Min
    貢獻者: 淡江大學機械與機電工程學系碩士班
    趙崇禮;Chao, Choung-Lii
    關鍵詞: 磨料噴射加工;SU-8遮罩技術;侵蝕機制;玻璃;微孔加工;Abrasive-Jet-machining;SU-8 mask technology;Erosion;Glass;Micro-hole-machining
    日期: 2016
    上傳時間: 2017-08-24 23:51:56 (UTC+8)
    摘要: 脆性材料如玻璃、矽、碳化矽通常被歸類為難加工材料,因為此類材料具有極高的硬度與脆性。然而由於它們具有優越的物理、光學、電子性質,因此越來越受到關注,並在各種科學、機械應用中一直扮演著重要的角色。具有各種尺寸與形狀微孔(陣列)之微圖形經常被要求在脆性材料上產生。許多學者嘗試了許多方式如雷射剝蝕、超音波加工、迴轉式超音波加工…來在脆性材料上產生微孔。本研究將應用磨料噴射加工在玻璃上製造陣列微孔。進行實驗以調查顆粒尺寸、噴嘴與工件距離、壓力、掃描速率對移除率與孔洞成形精度的影響。實驗成功在0.4mm厚的玻璃板上製作出各種形狀、特徵尺寸0.2mm至2mm的微孔。
    Brittle materials such as glasses, silicon, silicon carbide are normally categorized as difficult to machine materials for its high hardness and brittleness s. However, they have attracted more and more attentions and been playing critical roles in many scientific/engineering applications for their advanced physic/optical/electronic properties. Micro-patterns such as micro-hole (array) of various sizes and shapes are frequently required to be generated on brittle materials. Many researchers have tried different approaches such as laser ablation, ultrasonic machining, rotary ultrasonic machining…. to produce micro-hole in brittle materials. This research applied abrasive jet machining to fabricate micro-hole array on glass. Efforts have been made to investigated the effect of grit-size, stand-off distance, pressure, scanning speed on the material removal rate and the obtained hole accuracy. Micro-holes of various shapes and with characteristic dimension ranged from 0.2mm to 2mm are successfully produced in glass plate of 0.4mm thickness.
    顯示於類別:[機械與機電工程學系暨研究所] 學位論文

    文件中的檔案:

    檔案 描述 大小格式瀏覽次數
    index.html0KbHTML74檢視/開啟

    在機構典藏中所有的資料項目都受到原著作權保護.

    TAIR相關文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回饋