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    Title: 冷卻溫度對逆流熱虹吸迴路之初步探討
    Other Titles: Preliminary study of cooling temperature on reverse thermosyphon loop
    Authors: 何衛明;Ho, Wei-Ming
    Contributors: 淡江大學機械與機電工程學系碩士班
    康尚文;Kang, Shung-Wen
    Keywords: 逆流熱虹吸迴路;向下傳熱;機械泵;冷卻溫度;穩態;振幅;熱阻;Reverse thermosyphon loop;Down Heat;Mechanical Pump;Cooling Temperature;Steady State;Amplitude;Thermal resistance
    Date: 2016
    Issue Date: 2017-08-24 23:51:49 (UTC+8)
    Abstract: 逆流熱虹吸迴路為一可自主向下大量傳熱之裝置,整體作動藉由蒸汽壓力及重力來完成,不需倚靠機械泵或閥件來驅動,本裝置可以用來解決傳統工業用熱虹吸管僅能向上傳熱之缺點。實驗裝置固定冷卻端的溫度,分別控制在10°C、15°C、20°C、25°C、30°C及35 °C,並搭配80 W、100 W、120 W、140 W、160 W、180 W、200 W及210 W,8種不同加熱功率進行實驗,藉由實驗數據探究冷卻溫度對裝置推動力的影響,當冷卻溫度和加熱功率越高時,本裝置啟動時間越早,啟動時間約2000秒到3000秒左右;當時間達到10000秒時整個裝置會接近於穩態,並且持續循環作動。迴路流動非連續性,在較高瓦數操作時頻率為40-45秒一個循環,且冷卻溫度影響震幅不影響頻率。當在同一個加熱功率下,冷卻溫度越高,熱阻值會逐漸降低。
    The Reverse Thermosyphon Loop is an autonomous downward heat transfer device and the actuation is driven by steam pressure and gravity, which do not rely on mechanical pump to drive the valve member. The device can overcome the shortage of the traditional industrial thermosiphon, which depends on the natural upward movement of vapor steam, hot fluid and the downward movement of cold liquids. Fixed experimental temperature of cooling side were controlled at 10°C, 15°C, 20°C, 25°C, 30°C and 35 °C, and with eight different heating power which were 80W, 100W, 120W, 140W, 160W, 180 W, 200W and 210W, respectively. The experimental data were used to explore the influence of the cooling temperature on the driving force of the apparatus. When the cooling temperature or the heating power is higher, the device start earlier, the start-up time is about 2000 seconds to 3000 seconds. When the time reaches 10,000 seconds the entire apparatus will be closer to steady state continuous close loop. Loop flow discontinuity in high wattage and its operating frequency is 40-45 seconds a cycle, and the cooling temperature affect its amplitude and does not affect the frequency. When in the same heating power, the higher the cooling temperature, the thermal resistance will be gradually reduced.
    Appears in Collections:[機械與機電工程學系暨研究所] 學位論文

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