Pad Conditioning Density Distribution in CMP Process With Diamond Dresser

淡江大學機構典藏 > 工學院 > 航空太空工程學系暨研究所 > 期刊論文 > Item 987654321/106307

Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/106307

Title:	Pad Conditioning Density Distribution in CMP Process With Diamond Dresser
Authors:	Feng, Tyan
Keywords:	Chemical–mechanical polishing (CMP);Preston equation;conditioning density;diamond dresser;pad dressing
Date:	2007-11-12
Issue Date:	2016-04-22 13:45:34 (UTC+8)
Publisher:	IEEE
Abstract:	In the chemical-mechanical polishing (CMP) process, the pad conditioning density distribution plays a crucial role in the pad wear. A precise model and detailed analysis of a conditioning density function are required. To this end, at first we construct the mathematical model of polishing trajectories on the pad, then under the assumptions that the diamond grains are uniformly distributed and a slow sweeping motion is applied during dressing, the conditioning density distribution for a pad in CMP process is determined. This conditioning density function is verified through numerous numerical examples. In the mean time, it was also observed that to have a flat distribution of pad wear rate we have to make the ratio of disk-radius to pad-radius small, and the effect of the pattern of grain distribution on conditioning density function is insignificant, which agrees with known results from literature.
Relation:	IEEE Transactions on Semiconductor Manufacturing 20(4), 464-475
DOI:	10.1109/TSM.2007.907618
Appears in Collections:	[航空太空工程學系暨研究所] 期刊論文

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	275	View/Open