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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/105769


    Title: Development of on-board avionics for a 15-gram flapping MAV
    Other Titles: 15克重微飛行器之機載航電元件開發
    Authors: 蘇希德;Marimuthu, Suseendar
    Contributors: 淡江大學機械與機電工程學系碩士班
    楊龍杰;Yang, Lung Jieh
    Keywords: 拍翼機;方向控制;高度控制;輕量化電路板;flapping micro-air-vehicle (MAV);Avionics;Autonomous Control;flapping wing control
    Date: 2015
    Issue Date: 2016-01-22 15:04:48 (UTC+8)
    Abstract: 論文提要內容:
    文章中提到了一款新的可重複編寫,並且可搭載在拍翼機上的控制晶片。一開始文章中先分別介紹晶片中所使用的ATmeg328P微型處理器、慣性量測系統和高度感測器,在這章節也會剖析並詳細介紹這些感測器的選擇和如何使用這些感測數據,並應用在實際的飛行上面。
    這次主要飛行任務,是讓拍翼機具備自主方向控制,可以依照設定在不同起飛位置都能飛往設定的方向。
    下面文章將介紹M1AP,也就是新設計的控制晶片,M1AP是一個多功能可編寫並且可連接Arduino平台的晶片,晶片重量僅有0.75克重,並且包含了有12C的數位輸入和輸出、模擬輸入和輸出,還有SPI接口。最後將介紹整個M1AP的操作流程和使用方法。
    Abstract:
    This thesis presents the full development cycle of a programmable, lightweight control architecture capable of autonomously guiding a 15 gram flapping MAV by using onboard sensing and computational resources. In the earlier phase of the work, the prototyping of the control board housing an ATmega328P microcontroller, interfaced with Inertial Measurement Unit (IMU) and a pressure sensor is described. These chapters also dissect and examine in detail the choice of sensors, the practical usage of sensor data and control methods to actuate the MAV. The prototype board is used for a proof-of-concept flight test where the flapping wing MAV is autonomously guided towards a preprogrammed direction.
    The following chapters describe the design and development of the integrated control chip named “M1AP” housing all the components that are required. The M1AP is a fully functional and programmable chip compatible with Arduino platform, weighing 0.75 grams in weight. It includes interfaces for I2C, digital input and output, Analog input and output and also SPI programming. The standard operating procedure for uploading the firmware to M1AP is described and consequently, the direction seeking program performed during prototype stage is repeated with the new chip and the results are discussed.
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Thesis

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