Morphology and mechanical properties of dual-curable epoxyacrylate hybrid composites

doi:10.1002/app.41820

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Title:	Morphology and mechanical properties of dual-curable epoxyacrylate hybrid composites
Authors:	Su, Yu-Chieh;Don, Trong-Ming
Keywords:	mechanical properties;composites;adhesives;elastomers
Date:	2015-04-15
Issue Date:	2016-01-06 11:01:10 (UTC+8)
Abstract:	A dual-curable epoxyacrylate (EA) oligomer with one epoxide group and one vinyl group at each end was synthesized for the application as adhesive sealant in the liquid crystal display panels. However, after UV and thermal cure, the EA resin was brittle with a poor resistance to crack initiation and propagation. Liquid rubbers with different functional end groups were thus tried as toughening agents for the EA resin. Among all the rubber-toughened EAs, the EA-V5A5 added with vinyl-terminated and amino-terminated butadiene-acrylonitrile copolymers (VTBN and ATBN) each at 5 phr had the highest fracture toughness, tensile strength, and elongation at break but a lower initial modulus. To raise the modulus, submicron-sized silica particles (∼170 nm) with surface vinyl functional groups were further added to the EA-V5A5 to prepare the hybrid composites. Because of interfacial chemical bonding provided by the surface vinyl functional groups, both modulus and fracture toughness were increased by adding silica particles, without any appreciable decrease in extensibility. For the hybrid composite at 20 phr silica particles, the initial modulus, fracture toughness, and fracture energy were raised by 10.3, 100, and 267%, respectively, when compared to the neat epoxyacrylate. Owing to their strong interfacial bonding, the increase of fracture toughness was mainly due to the crack deflection and bifurcation on silica particles, in addition to the rubber particle bridging and tearing as evidenced by SEM pictures on the fracture surface.
Relation:	Journal of Applied Polymer Science 132(15), 41820
DOI:	10.1002/app.41820
Appears in Collections:	[Graduate Institute & Department of Chemical and Materials Engineering] Journal Article

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