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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/102664

    Title: 手機晶片散熱結構
    Other Titles: Heat dissipation mechanism in cell phone chip
    Authors: 葉俊頤;Yeh, Chun-Yi
    Contributors: 淡江大學電機工程學系碩士在職專班
    李揚漢;Lee, Yang-Han
    Keywords: 行動通訊裝置;中央處理器散熱;散熱裝置;散熱媒介;優化系統;Mobile Communication Devices;Central Processor Heat;Heat Dissipation Apparatus;Heat Dissipation Medium;Optimization System
    Date: 2014
    Issue Date: 2015-05-04 10:01:25 (UTC+8)
    Abstract: 近年來,行動通訊裝置迅速發展,電腦執行速度愈來愈快,處理器執行速度越來越快,而尺寸愈來愈小,為了將此密集熱量有效散發,以維持處理器於許可溫度之下運作,用以協助處理器散熱,來增加散熱能力。
    In recent years, the rapid development of mobile devices, computer running more quickly speed, the processor executes at an increasing rate, size becoming smaller and smaller, in order to effectively distribute heat densely, maintain the temperature of the processor operating in permission, to assist in processor heat dissipation, increase heat dissipation.
    Older cell phone space mining natural heat dissipation, do not strengthen in the heat dissipation, but the high temperature air cooling effect making the greatly reduced.
    The master point to provide a heat dissipation device system, posted in major chip heat dissipation intermediary apparatus, high temperature dose not stay on the chip, rapid heat dissipation effect, effectively increase the heat dissipation efficiency of the processor.
    Cell phone which is generally not considered for the heat dissipation, poorer heat dissipation effect, space limitations、caused by costs down. In this use main chip、power chip to cover the upper space to add a heat dissipation device, such as copper sheet, achieve main chip heat dissipation effect. Inside the device relative reduction temperature on main chip, optimization system performance increase on host, increase application is running and smooth、speed of 3G、WIFI.
    Appears in Collections:[電機工程學系暨研究所] 學位論文

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