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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/102171

    Title: 應用六標準差方法探討半導體測試品質
    Other Titles: The study of Six Sigma approach on semiconductor testing quality
    Authors: 翁榮駿;Weng, Rong-Chun
    Contributors: 淡江大學管理科學學系企業經營碩士在職專班
    李旭華;Lee, Hsu-Hua
    Keywords: 六標準差;DMAIC;失效模式分析;實驗設計;six sigma management;FMEA;DOE
    Date: 2014
    Issue Date: 2015-05-04 09:49:10 (UTC+8)
    Abstract: 台灣的半導體測試業是在1980年後蓬勃的發展,也造就了很多專業的半導體測試廠。且隨著IC製造廠投資額增大,加上廠房供給有限,促使IDM業者,在設備投資及管理成本等考量下,將測試訂單釋出,並交由專業的半導體測試廠進行測試已經成為趨勢。
    The IC testing in Taiwan has grown dramatically after 1980, and also created a lot of professional semiconductor test facility. With IC manufacturing and investment increases, coupled with the limited supply of the plant, prompting IDM industry, in the measure of the cost of equipment investment and management considerations, will test released orders and hand over to a professional semiconductor test plant for testing, and this has become the trend.
    Unlike the semiconductor manufacturing with the pressure of inventory, the industry is testing machine with lease time charges, so the level of higher utilization of the machine under normal conditions can come to the optimal performance and profit after considering equipment depreciation and fixed costs. Therefore, to enhance effective equipment utilization rate and yield of products can enhance the utilization of the machine, and thus result in more profit.
    This study is based on Six Sigma improvement techniques, and through the DMAIC approach, the semiconductor testing processes are identified. The impact of the causes on equipment utilization rate and product yield is analyzed and the improvement actions have been taken to reduce defective products and enhance the utilization of equipment and relevant profit.
    Appears in Collections:[管理科學學系暨研究所] 學位論文

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